ICDE 20250
IEEE International Conference on Data Engineering 
Acc. Rate: 25.4%(376/1481 24') · 30.6%(229/748 23')
DATES
May 20-23, 2025
VENUE
Hong Kong, China
NOTE: first round · second round
NEXT DEADLINE INPassed
IMPORTANT DEADLINES
Round 1 Paper Submission Deadline
Round 2 Paper Submission Deadline
