RE 20270

IEEE International Requirements Engineering Conference
Acc. Rate: 24.0%(24/100 26') · 21.3%(23/108 25')
DATES
August 23-27, 2027
VENUE
Milan, Italy
NEXT DEADLINE INTBD

IMPORTANT DEADLINES

Dates to be announced
CCF BCORE ATHCPL N软件工程/系统软件/程序设计语言

past venues