SCAM 20230

IEEE International Working Conference on Source Code Analysis and Manipulation
Acc. Rate: 40.4%(21/52 23') · 37.8%(17/45 22')
DATES
October 2-3, 2023
VENUE
Bogota, Colombia
NEXT DEADLINE INPassed

IMPORTANT DEADLINES

Abstract Submission Deadline
Paper Submission Deadline
CCF CCORE CTHCPL N软件工程/系统软件/程序设计语言

past venues