SSE 20250

IEEE International Conference on Software Services Engineering
Acc. Rate: 35.8%(19/53 25') · 37.9%(22/58 24')
DATES
July 8-10, 2025
VENUE
Helsinki, Finland
NEXT DEADLINE INPassed

IMPORTANT DEADLINES

Paper Submission Deadline
CCF CCORE BTHCPL B软件工程/系统软件/程序设计语言

past venues