ISSTA 2022

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ACM SIGSOFT International Symposium on Software Testing and Analysis
Acc. Rate: 24.4%(61/250 22') · 23.3%(51/219 21')
DATES
July 20-22, 2022
VENUE
Daejeon, South Korea
NEXT DEADLINE INPassed

IMPORTANT DEADLINES

Paper Submission
Conference Opening
08:00, Jul 20, 2022 · AoE
CCF ACORE ATHCPL A软件工程/系统软件/程序设计语言

Past venues