ISSTA 20240

ACM SIGSOFT International Symposium on Software Testing and Analysis

Acc. Rate: 20.6%(143/694 24') · 24.4%(61/250 22')

DATES

September 18-20, 2024

VENUE

Vienna, Austria

NOTE: Round 1 · Round 2

NEXT DEADLINE INPassed

IMPORTANT DEADLINES

Round 1 Paper Submission Deadline

23:59, Dec 15, 2023 · AoE

Round 2 Paper Submission Deadline

23:59, Apr 12, 2024 · AoE

CCF ACORE ATHCPL A软件工程/系统软件/程序设计语言