ISSTA 20250 ACM SIGSOFT International Symposium on Software Testing and Analysis Acc. Rate: 20.6%(143/694 24') · 24.4%(61/250 22') DATESJune 25-27, 2025 VENUETrondheim, Norway NEXT DEADLINE INPassed IMPORTANT DEADLINESPaper Submission Deadline23:59, Oct 31, 2024 · AoE CCF ACORE ATHCPL A软件工程/系统软件/程序设计语言 Visit website ↗Google CalendariCloud Calendar